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Fortune Mount International Ltd  

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Multilayer FR-4 PCB Assembly For Industrial Control, One Stop Printed Circuit Board Assembly Service 

Place of Origin: Zhejiang, China (Mainland) 
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Multilayer FR-4 PCB Assembly For Industrial Control, One Stop Printed Circuit Board Assembl

Multilayer FR-4 PCB Assembly For Industrial Control, One Stop Printed Circuit Board Assembly Service

 

Key Specifications/Special Features:

  • Our manufacturing facilities include clean workshops and high speed advanced SMT lines
  • Our placement precision can reach chip +0.1mm on integrated circuit parts, which means we can almost deal with all kinds of integrated circuits such as SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA
  • Additionally, we can provide 0201 chip placement, through-hole components insertion and finished products fabrication, testing and package
  • Production of customer designed components
  • SMD assembly and through-hole components insertion
  • IC preprogramming
  • Function verification and burn in testing
  • Complete unit assembly (which including plastics, metal box, coil, cable inside and more)
  • Environmental coating
  • Engineering including end of life components, obsolete component replace and design support for circuit, metal and plastic enclosure
  • Packaging design
  • We are committed to improving our product quality constantly
  • The products delivered from us shall be full quality checked, striving to 100% customer's satisfaction is our long term mission
  • To work with a reliable EMS provider with high mixed, low volume order, contact us today

 

Our services for the PCB Assembly

  • Re-layout for shortening the board size
  • Bare pc board fabrication
  • SMT/BGA/DIP assembly
  • Full component procurement or the substitute components sourcing
  • Wire harness and cable assembly
  • Metal parts, rubber parts and plastic parts including mold making
  • Mechanical, case and rubber molding assembly
  • Functional testing
  • Repairs and inspection of the sub-finished / finished goods

 

Our capabilities for the PCB Assembly

 

Stencil Size Range

736 mm x 736 mm

Min. IC Pitch

0.30 mm

Max. PCB Size

410 mm x 360 mm

Min. PCB Thickness

0.35 mm

Min. Chip Size

0201 (0.6 mm X 0.3 mm)

Max. BGA Size

74 mm X 74 mm

BGA Ball Pitch

1.00 mm (Min) / F3.00 mm (Max)

BGA Ball Diameter

0.40 mm (Min) /F1.00 mm (Max)

QFP Lead Pitch

0.38 mm (Min) /F2.54 mm (Max)

Frequency of Stencil Cleaning

1 time / 5 ~ 10 Pieces

 

 

Our manufacturing experience includes, but is not limited to:

 

Note Book fields

CHARGER BOARD

INVERTER

POWER CPU

LVDS CARD

IR BOARD

LCD MOTHERBOARD

LED BOARD

RAM CARD

DATA BOARD

BATT BOARD

DVR MOTHERBOARD

USB BOARD

CARD READER

AUDIO BOARD

ISDN MODEN

PC fields

2.5 inch HDD

PC/MAC FDD

DOCKING
PORT

PORT REPILICATOR

PCMCIA CARD

3.5 inch HDD

SATA HDD

ADAPTER

DVD ROM

SSD

Telecom fields

bigPhoto
 Mr. Ken PAN
General Manager
Tel: 86-755-33100752
Fax: 86-86549315
Mobile: 86- 150 1255 2288
Contact to this supplier

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Company Info

Fortune Mount International Ltd [China (Mainland)]


Business Type:Manufacturer
City: Shenzhen
Province/State: Guangdong
Country/Region: China (Mainland)

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