Immersion Gold Custom Multilayer PCB Board, 4 layer CEM-3 FR-4 Printed Circuit Board Assembly

Key Specifications/Special Features:

Fabrication data inputs: Gerber data RS-274-X or RS-274-D with aperture list and drill files, design file with Protel, PAD2000, POWERPCB, ORCAD

• Layers 2-30 L
• Material Types Fr-4, Fr-5, High-Tg, Halogen Free, Rogers,
• Isola, Taconic, Arlon, Teflon, Aluminum Based
• Max. Panel Dimension 39000mil * 47000mil / 1000mm * 1200mm
• Outline Tolerance ±4mil ±0.10mm
• Board Thickness 8mil-236mil / 0.2mm-6.0mm
• Board Thickness Tolerance ±10%
• Dielectric Thickness 3mil-8mil / 0.075mm-0.20mm
• Min. Track Width 3mil / 0.075mm
• Min. Track Space 3mil / 0.075mm
• External Cu Thickness HOZ-6OZ / 17um~210um
• Internal Cu Thickness HOZ-6OZ / 17um~210um
• Drilling Bit Size ( CNC ) 6mil-256mil / 0.15mm-6.50mm
• Finished Hole Dimension 4mil-236mil / 0.1mm—6.0mm
• Hole Tolerance ±2mil / ±0.05mm
• Hole Position Tolerance ±2mil / ±0.05mm
• Laser Drilling Hole Size 4mil / 0.1mm
• Aspect Ration 12:1
• Solder Mask Green, Blue, White, Black, Red, Yellow, Purple, etc.
• Min Solder mask Bridge 2mil / 0.050mm
• Plugged Hole Diameter 8mil-20mil / 0.20mm-0.50mm
• Impedance Control V-scoring ±10%
• Surface Finishing HASL, HASL(lead Free), Immersion Gold, Immersion Tin,
• Immersion Silver, OSP, Hard Gold( up to 100u”)
• UL and TS16949: 2002 marks
• Special requirements: buried and blind vias, impedance control, via plug, BGA soldering and gold finger
• Profiling: punching, routing, V-cut and beveling
• OEM services to all sorts of printed circuit board assembly as well as electronic encased products are provided

PCB assembly:

• Consumer, computer, communication, industrial, security, power, traffic control board SMD, DIP, AI OEM/ODM assembly
• Complete product including plastics, metal works, microchip programming and functional testing process small order, high-mixed accept turn-key service including components procurement, produce, quality check, package, logistics

We provide total solutions including:

• Product development: for single-sided and multilayer PCBA
• Design: layout and re-layout
• Tooling: plastic injection molding and metal casting
• Manufacturing: SMT, BGA and DIP
• Quality certification: ICT and FCT tests
• Aftersales services
• OEM and ODM project is accepted

Equipment in our PCBA facilities includes:

• Functional, electrical and in-circuit testing equipment
• Optical microscopes
• NC data programming machines
• Multifunction placement machines
• Full-vision solder printing machines
• Full-vision high-sped pick-and-place machines
• BTU reflow machines
• Microfocus X-ray fluoroscopy system