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prototype circuit board assembly pcb design and assembly 

Place of Origin: Zhejiang, China (Mainland) 
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EMS PCBA & PCB Board Assembly, Double Sized 6 Layer BGA Assembly For Industrial Controller<

EMS PCBA & PCB Board Assembly, Double Sized 6 Layer BGA Assembly For Industrial Controller

 

Key Specifications/Special Features:

•     Provides OEM services to all sorts of printed circuit board assemblies as well as electronic encased products

•     We provide the real vertically integrated OEM service form procurement, plastic tooling/injection,

•     Can place 0201 SMD chip , BGA and x-ray ,AOI inspection

•     Taking IPC-A-160 standard which is the most widely recognized standard of electronic assemblies

•     Complicated boards and components available

•     PCB assembly, final casing assembly/testing, quality assurance to shipping

•     In-circuit testing capability for PCBAs

•     PCBA/SMT/final assembly -vertical integrated manufacturing solution

•     Profound knowledge of contract manufacturing services

•     Capable of developing effective production process to ensure high quality and consistency

•     Experienced logistic control

•     Cost-effective factory located in China

•     Flexible production for customers' required volumes

•     Reliable circuit board available in soldering and casing assembly

•     The overall quality of assembled product is guaranteed by the quality of the components made

•     Reliable contract assembly service provides optimal flexibility

 

Our services for the PCB Assembly

  • Re-layout for shortening the board size
  • Bare pc board fabrication
  • SMT/BGA/DIP assembly
  • Full component procurement or the substitute components sourcing
  • Wire harness and cable assembly
  • Metal parts, rubber parts and plastic parts including mold making
  • Mechanical, case and rubber molding assembly
  • Functional testing
  • Repairs and inspection of the sub-finished / finished goods

 

Our capabilities for the PCB Assembly

 

Stencil Size Range

736 mm x 736 mm

Min. IC Pitch

0.30 mm

Max. PCB Size

410 mm x 360 mm

Min. PCB Thickness

0.35 mm

Min. Chip Size

0201 (0.6 mm X 0.3 mm)

Max. BGA Size

74 mm X 74 mm

BGA Ball Pitch

1.00 mm (Min) / F3.00 mm (Max)

BGA Ball Diameter

0.40 mm (Min) /F1.00 mm (Max)

QFP Lead Pitch

0.38 mm (Min) /F2.54 mm (Max)

Frequency of Stencil Cleaning

1 time / 5 ~ 10 Pieces

 

 

Our capabilities for handling the Bare PC Board fabrication

 

Fabrication data inputs: Gerber data RS-274-X or RS-274-D with aperture list and drill files, design file with Protel, PAD2000, POWERPCB, ORCAD

Layers 2-30 L
Material Types Fr-4, Fr-5, High-Tg, Halogen Free, Rogers,
Isola, Taconic, Arlon, Teflon, Aluminum Based
Max. Panel Dimension 39000mil * 47000mil / 1000mm * 1200mm
Outline Tolerance ±4mil ±0.10mm
Board Thickness 8mil-236mil / 0.2mm-6.0mm
Board Thickness Tolerance ±10%
Dielectric Thickness 3mil-8mil / 0.075mm-0.20mm
Min. Track Width 3mil / 0.075mm
Min. Track Space 3mil / 0.075mm
External Cu Thickness HOZ-6OZ / 17um~210um
Internal Cu Thickness HOZ-6OZ / 17um~210um
Drilling Bit Size ( CNC ) 6mil-256mil / 0.15mm-6.50mm
Finished H

bigPhoto
 Mr. Ken PAN
General Manager
Tel: 86-755-33100752
Fax: 86-86549315
Mobile: 86- 150 1255 2288
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Company Info

Fortune Mount International Ltd [China (Mainland)]


Business Type:Manufacturer
City: Shenzhen
Province/State: Guangdong
Country/Region: China (Mainland)

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