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Fortune Mount International Ltd
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FR-4 Printed Circuit Board Assembly for Stock Control, Single Sided Smt / Bga / Dip Assembly Service
| Place of Origin: | Zhejiang, China (Mainland) |
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Product Detail
FR-4 Printed Circuit Board Assembly for Stock Control, Single Sided Smt / Bga / Dip Assembly Service</st
FR-4 Printed Circuit Board Assembly for Stock Control, Single Sided Smt / Bga / Dip Assembly Service
Our capabilities for handling the Bare PC Board fabrication
Fabrication data inputs: Gerber data RS-274-X or RS-274-D with aperture list and drill files, design file with Protel, PAD2000, POWERPCB, ORCAD
Layers 2-30 L
Material Types Fr-4, Fr-5, High-Tg, Halogen Free, Rogers,
Isola, Taconic, Arlon, Teflon, Aluminum Based
Max. Panel Dimension 39000mil * 47000mil / 1000mm * 1200mm
Outline Tolerance ±4mil ±0.10mm
Board Thickness 8mil-236mil / 0.2mm-6.0mm
Board Thickness Tolerance ±10%
Dielectric Thickness 3mil-8mil / 0.075mm-0.20mm
Min. Track Width 3mil / 0.075mm
Min. Track Space 3mil / 0.075mm
External Cu Thickness HOZ-6OZ / 17um~210um
Internal Cu Thickness HOZ-6OZ / 17um~210um
Drilling Bit Size ( CNC ) 6mil-256mil / 0.15mm-6.50mm
Finished Hole Dimension 4mil-236mil / 0.1mm—6.0mm
Hole Tolerance ±2mil / ±0.05mm
Hole Position Tolerance ±2mil / ±0.05mm
Laser Drilling Hole Size 4mil / 0.1mm
Aspect Ration 12:1
Solder Mask Green, Blue, White, Black, Red, Yellow, Purple, etc.
Min Solder mask Bridge 2mil / 0.050mm
Plugged Hole Diameter 8mil-20mil / 0.20mm-0.50mm
Impedance Control V-scoring ±10%
Surface Finishing HASL, HASL(lead Free), Immersion Gold, Immersion Tin,
Immersion Silver, OSP, Hard Gold( up to 100u”)
- UL and TS16949: 2002 marks
- Special requirements: buried and blind vias, impedance control, via plug, BGA soldering and gold finger
- Profiling: punching, routing, V-cut and beveling
- OEM services to all sorts of printed circuit board assembly as well as electronic encased products are provided
Our services for the PCB Assembly
- Re-layout for shortening the board size
- Bare pc board fabrication
- SMT/BGA/DIP assembly
- Full component procurement or the substitute components sourcing
- Wire harness and cable assembly
- Metal parts, rubber parts and plastic parts including mold making
- Mechanical, case and rubber molding assembly
- Functional testing
- Repairs and inspection of the sub-finished / finished goods
Our capabilities for the PCB Assembly
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Stencil Size Range |
736 mm x 736 mm |
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Min. IC Pitch |
0.30 mm |
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Max. PCB Size |
410 mm x 360 mm |
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Min. PCB Thickness |
0.35 mm |
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Min. Chip Size |
0201 (0.6 mm X 0.3 mm) |
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Max. BGA Size |
74 mm X 74 mm |
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BGA Ball Pitch |
1.00 mm (Min) / F3.00 mm (Max) |
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BGA Ball Diameter |
0.40 mm (Min) /F1.00 mm (Max) |
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QFP Lead Pitch |
0.38 mm (Min) /F2.54 mm (Max) |
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Frequency of Stencil Cleaning |
1 time / 5 ~ 10 Pieces |
Our manufacturing experience includes, but is not limited to:
